4 Patents
- US120339802024Thermal Pads Between Stacked Semiconductor Dies and Associated Systems and Methods
Micron Technology, Inc.
0 cites - US117768772023Methods of Manufacturing Stacked Semiconductor Die Assemblies with High Efficiency Thermal Paths
Micron Technology, Inc.
0 cites - US116886642023Semiconductor Device Assembly with Through-mold Cooling Channel Formed in Encapsulant
Micron Technology, Inc.
0 cites - US115944622023Stacked Semiconductor Die Assemblies with Multiple Thermal Paths and Associated Systems and Methods
Micron Technology, Inc.
0 cites