6 Patents
- US124128682025Microelectronic Assemblies Including Interconnects with Different Solder Materials
Intel Corporation
0 cites - US121762922024Microelectronic Component Having Molded Regions with Through-mold Vias
Intel Corporation
0 cites - US120681722024Sacrificial Pads to Prevent Galvanic Corrosion of FLI Bumps in EMIB Packages
Intel Corporation
0 cites - US118173902023Microelectronic Component Having Molded Regions with Through-mold Vias
Intel Corporation
0 cites - US116886922023Embedded Multi-die Interconnect Bridge Having a Substrate with Conductive Pathways and a Molded Material Region with Through-mold Vias
Intel Corporation
0 cites - US116409422023Microelectronic Component Having Molded Regions with Through-mold Vias
Intel Corporation
0 cites