Jason An Cheng Huang

5 Patents

• US126149882026

  Low Parasitic Inductance Power Module Featuring Staggered, Interleaving Conductive Members

  SENTEC E&E CO., Ltd.

  0 cites
• US125937002026

  Low Parasitic Inductance Power Module Having Staggered, Interleaving Conductive Busbars

  SENTEC E&E CO., Ltd.

  0 cites
• US124631882025

  Flip-chip Packaged Power Transistor Module Having Built-in Gate Driver

  Sentec Green Energy Technology Co., Ltd.

  0 cites
• US124518172025

  Power Module

  SENTEC E&E CO., Ltd.

  0 cites
• US124179672025

  Low Parasitic Inductance Power Module Featuring Staggered Interleaving Conductive Members

  SENTEC E&E CO., Ltd.

  0 cites