Jared Stoeger

4 Patents

• US124761832025

  Punch-through Interconnect Feature to Couple Upper Electrodes of Capacitors of Multi-level Memory Arrays

  Intel Corporation

  0 cites
• US124262472025

  Capacitor Connections in Dielectric Layers

  Intel Corporation

  0 cites
• US118324382023

  Capacitor Connections in Dielectric Layers

  Intel Corporation

  0 cites
• US115631072023

  Method of Contact Patterning of Thin Film Transistors for Embedded DRAM Using a Multi-layer Hardmask

  Intel Corporation

  0 cites