3 Patents
- US126223002026Method of Assembling Partitioned Organic Substrate in a Flip Chip Package
Marvell Asia Pte Ltd
0 cites - US125884702026Methods for Assembling Stacked Substrate Packages Including Dies, Laminated Base Substrates, and Dielectric Build-up Substrates
MARVELL ASIA PTE Ltd
0 cites - US116826462023IC Chip Package with Dummy Solder Structure Under Corner, and Related Method
MARVELL ASIA PTE Ltd.
0 cites