Patents/Inventors

Jan Richter

DresdenDE17 patents

17 Patents

US125395652026
Method for Producing Short Subcritical Cracks in Solid Bodies
Siltectra GmbH
0 cites
US122117022025
Solid Body and Multi-component Arrangement
Siltectra GmbH
0 cites
US121901622025
Optimized Allocation of Resources to Nodes of an Automation System Based on Monte Carlo Simulation
Siemens Aktiengesellschaft
0 cites
US121598052024
Method for Producing Wafers with Modification Lines of Defined Orientation
Siltectra GmbH
0 cites
US121513142024
Device and Method for Applying Pressure to Stress-producing Layers for Improved Guidance of a Separation Crack
Siltectra GmbH
0 cites
US120976412024
Method for Forming a Crack in an Edge Region of a Donor Substrate
Siltectra GmbH
0 cites
US120302162024
Method for Separating Wafers from Donor Substrates
Siltectra GmbH
0 cites
US119963312024
Method for Separating a Solid Body
Siltectra GmbH
0 cites
US118698102024
Method for Reducing the Thickness of Solid-state Layers Provided with Components
Siltectra GmbH
0 cites
US118336172023
Splitting of a Solid Using Conversion of Material
Siltectra GmbH
0 cites
US118223072023
Laser Conditioning of Solid Bodies Using Prior Knowledge from Previous Machining Steps
Siltectra GmbH
0 cites
US117869952023
Nonplanar Wafer and Method for Producing a Nonplanar Wafer
Siltectra GmbH
0 cites
US117870832023
Production Facility for Separating Wafers from Donor Substrates
Siltectra GmbH
0 cites
US117722012023
Method for Separating Solid Body Layers from Composite Structures Made of Sic and a Metallic Coating or Electrical Components
Siltectra GmbH
0 cites
US117127492023
Parent Substrate, Wafer Composite and Methods of Manufacturing Crystalline Substrates and Semiconductor Devices
Infineon Technologies AG
0 cites
US116996162023
Method for Producing a Layer of Solid Material
Siltectra GmbH
0 cites
US116642772023
Method for Thinning Solid-body Layers Provided with Components
Siltectra GmbH
0 cites