Patents/Inventors

Jan Proschwitz

RiesaDE7 patents

3 Patents

US126223192026
Stacked Die Packaging Architecture with Conductive Vias on Interposer
Intel Corporation
0 cites
US119904082024
WLCSP Reliability Improvement for Package Edges Including Package Shielding
Intel Corporation
0 cites
US118046832023
Snap Button Fastener Providing Electrical Connection
Intel Corporation
0 cites