5 Patents
- 0 cites
- US119012322024Automatic Kerf Offset Mapping and Correction System for Laser Dicing
Applied Materials, Inc.
0 cites - US118548882023Laser Scribing Trench Opening Control in Wafer Dicing Using Hybrid Laser Scribing and Plasma Etch Approach
Applied Materials, Inc.
0 cites - US117640612023Water Soluble Organic-inorganic Hybrid Mask Formulations and Their Applications
Applied Materials, Inc.
0 cites - US116004922023Electrostatic Chuck with Reduced Current Leakage for Hybrid Laser Scribing and Plasma Etch Wafer Singulation Process
Applied Materials, Inc.
0 cites