15 Patents
- US125766332026Matching Electrically Conductive Line Resistances to Switches in Fluidic Dies
Hewlett-packard Development Company, L.P.
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- US122578372025Interspersed Fluidic Elements and Circuit Elements in a Fluidic Die
Hewlett-packard Development Company, L.P.
0 cites - US122336472025Arrangements of Circuit Elements and Fluidic Elements
Hewlett-packard Development Company, L.P.
0 cites - 0 cites
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- US119517392024Fluidic Die with High Aspect Ratio Power Bond Pads
Hewlett-packard Development Company, L.P.
0 cites - 0 cites
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- US116851152023Additive Manufacturing with Nozzles at Different Die Widths
Hewlett-packard Development Company, L.P.
0 cites - 0 cites
- US116339492023Fluid Actuators Connected to Field Effect Transistors
Hewlett-packard Development Company, L.P.
0 cites - US115599872023Fluidic Die with Surface Condition Monitoring
Hewlett-packard Development Company, L.P.
0 cites - US115416582023Fluidic Die with Nozzle Layer Electrode for Fluid Control
Hewlett-packard Development Company, L.P.
0 cites