Patents/Inventors

James Michael Gardner

Corvallis, ORUS43 patents

44 Patents

US124036892025
Print Component with Memory Array Using Intermittent Clock Signal
Hewlett-packard Development Company, L.P.
0 cites
US123509322025
Die for a Printhead
Hewlett-packard Development Company, L.P.
0 cites
US123116612025
Integrated Circuits Including High-voltage High-power and High-voltage Low-power Supply Nodes
Hewlett-packard Development Company, L.P.
0 cites
US122402312025
Integrated Circuit with Address Drivers for Fluidic Die
Hewlett-packard Development Company, L.P.
0 cites
US122402452025
Logic Circuitry
Hewlett-packard Development Company, L.P.
0 cites
US121834302024
Communicating Print Component
Hewlett-packard Development Company, L.P.
0 cites
US121453602024
Integrated Circuits Including Memory Cells
Hewlett-packard Development Company, L.P.
0 cites
US121302802024
Identifying Random Bits in Control Data Packets
Hewlett-packard Development Company, L.P.
0 cites
US121157902024
Integrated Circuits Including Strain Gauge Sensors
Hewlett-packard Development Company, L.P.
0 cites
US120976952024
Accessing Registers of Fluid Ejection Devices
Hewlett-packard Development Company, L.P.
0 cites
US120446732024
Identifying Random Bits in Control Data Packets
Hewlett-packard Development Company, L.P.
0 cites
US120303122024
Print Component with Memory Circuit
Hewlett-packard Development Company, L.P.
0 cites
US119699952024
Integrated Circuits Including Memory Cells
Hewlett-packard Development Company, L.P.
0 cites
US119699982024
Multiple Circuits Coupled to an Interface
Hewlett-packard Development Company, L.P.
0 cites
US119387222024
Integrated Circuits Including Memory Cells
Hewlett-packard Development Company, L.P.
0 cites
US119320142024
Print Component Having Fluidic Actuating Structures with Different Fluidic Architectures
Hewlett-packard Development Company, L.P.
0 cites
US119120242024
Temperature Detection and Control
Hewlett-packard Development Company, L.P.
0 cites
US118972592024
Integrated Circuits Including Memory Cells
Hewlett-packard Development Company, L.P.
0 cites
US118582652024
Integrated Circuits Including Customization Bits
Hewlett-packard Development Company, L.P.
0 cites
US118400752023
Emulating Parameters of a Fluid Ejection Die
Hewlett-packard Development Company, L.P.
0 cites
US118069992023
Memories of Fluidic Dies
Hewlett-packard Development Company, L.P.
0 cites
US117871722023
Communicating Print Component
Hewlett-packard Development Company, L.P.
0 cites
US117871732023
Print Component with Memory Circuit
Hewlett-packard Development Company, L.P.
0 cites
US117802222023
Print Component with Memory Circuit
Hewlett-packard Development Company, L.P.
0 cites
US117802232023
Pulldown Devices
Hewlett-packard Development Company, L.P.
0 cites
US117600852023
Accessing Registers of Fluid Ejection Devices
Hewlett-packard Development Company, L.P.
0 cites
US117385622023
Logic Circuitry
Hewlett-packard Development Company, L.P.
0 cites
US117314192023
Integrated Circuits Including Customization Bits
Hewlett-packard Development Company, L.P.
0 cites
US117261462023
Contact Connectivity
Hewlett-packard Development Company, L.P.
0 cites
US117018802023
Die for a Printhead
Hewlett-packard Development Company, L.P.
0 cites
US116851532023
Communicating Print Component
Hewlett-packard Development Company, L.P.
0 cites
US116900152023
Reducing Listen Mode Power Consumption of a Wireless Local Area Network (WLAN) Device
QUALCOMM Incorporated
0 cites
US116766452023
Communicating Print Component
Hewlett-packard Development Company, L.P.
0 cites
US116671162023
Print Component Having Fluidic Actuating Structures with Different Fluidic Architectures
Hewlett-packard Development Company, L.P.
0 cites
US116428842023
Die for a Printhead
Hewlett-packard Development Company, L.P.
0 cites
US116390552023
Fluid Ejection Devices Including Contact Pads
Hewlett-packard Development Company, L.P.
0 cites
US116286672023
Multiple Circuits Coupled to an Interface
Hewlett-packard Development Company, L.P.
0 cites
US116254932023
Logic Circuitry
Hewlett-packard Development Company, L.P.
0 cites
US116131172023
Multiple Circuits Coupled to an Interface
Hewlett-packard Development Company, L.P.
0 cites
US116131182023
Die for a Printhead
Hewlett-packard Development Company, L.P.
0 cites
US116029322023
Zonal Firing Signal Adjustments
Hewlett-packard Development Company, L.P.
0 cites
US115907522023
Print Component with Memory Circuit
Hewlett-packard Development Company, L.P.
0 cites
US115599852023
Integrated Circuit with Address Drivers for Fluidic Die
Hewlett-packard Development Company, L.P.
0 cites
US115482762023
Integrated Circuits Including Customization Bits
Hewlett-packard Development Company, L.P.
0 cites