James M. Holden

2 Patents

• US121319522024

  Wafer Dicing Using Femtosecond-based Laser and Plasma Etch

  Applied Materials, Inc.

  0 cites
• US116211942023

  Wafer Dicing Using Femtosecond-based Laser and Plasma Etch

  Applied Materials, Inc.

  0 cites