10 Patents
- US124827442025Subtractively Patterned Interconnect Structures for Integrated Circuits
Intel Corporation
0 cites - US123410612025Bottom-up Fill Dielectric Materials for Semiconductor Structure Fabrication and Their Methods of Fabrication
Intel Corporation
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- US120274582024Subtractively Patterned Interconnect Structures for Integrated Circuits
Intel Corporation
0 cites - US119538262024Lined Photobucket Structure for Back End of Line (BEOL) Interconnect Formation
Intel Corporation
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- US118746002024Ligand-capped Main Group Nanoparticles as High Absorption Extreme Ultraviolet Lithography Resists
Intel Corporation
0 cites - 0 cites