Patents/Inventors

James J. Kelly

Schenectady, NYUS4 patents

5 Patents

US124697872025
Resist Patterned Redistribution Wiring on Copper Polyimide via Layer
International Business Machines Corporation
0 cites
US124380462025
Dual Redistribution Layer Structure
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites
US118482732023
Bridge Chip with Through Via
International Business Machines Corporation
0 cites
US117841202023
Metal via Structure
International Business Machines Corporation
0 cites
US116826402023
Protective Surface Layer on Under Bump Metallurgy for Solder Joining
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites