4 Patents
- US120465362024Integrated Heat Spreader with Enhanced Vapor Chamber for Multichip Packages
Intel Corporation
0 cites - US118814402024Carbon Based Polymer Thermal Interface Materials with Polymer Chain to Carbon Based Fill Particle Bonds
Intel Corporation
0 cites - US115629402023Integrated Heat Spreader Comprising a Silver and Sintering Silver Layered Structure
Intel Corporation
0 cites - 0 cites