Patents/Inventors

Jaimal Mallory Williamson

McKinney, TXUS8 patents

8 Patents

US125937102026
Package Substrate Having Porous Dielectric Layer
TEXAS INSTRUMENTS INCORPORATED
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US124890752025
Enhanced Mold Compound Thermal Conductivity
TEXAS INSTRUMENTS INCORPORATED
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US122782052025
Semiconductor Device Package with Improved Die Pad and Solder Mask Design
TEXAS INSTRUMENTS INCORPORATED
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US122665972025
Multilevel Package Substrate with Stair Shaped Substrate Traces
TEXAS INSTRUMENTS INCORPORATED
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US122438352025
Package Substrate with CTE Matching Barrier Ring Around Microvias
TEXAS INSTRUMENTS INCORPORATED
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US121990082025
Package Heat Dissipation Including a Die Attach Film
TEXAS INSTRUMENTS INCORPORATED
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US119730172024
Package Substrate Having Porous Dielectric Layer
TEXAS INSTRUMENTS INCORPORATED
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US118043822023
Method of Forming Package Substrate with Partially Recessed Capacitor
TEXAS INSTRUMENTS INCORPORATED
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