Patents/Inventors

Jaekyung Yoo

SeoulKR7 patents

9 Patents

US126108652026
Semiconductor Device and Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US123946412025
Molding Apparatus of Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US123623282025
Semiconductor Package and Method of Fabricating the Same
Samsung Electronics Co., Ltd.
0 cites
US121659912024
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US120626392024
Semiconductor Package and Method of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119233402024
Semiconductor Package Including Mold Layer and Manufacturing Method Thereof
Samsung Electronics Co., Ltd.
0 cites
US119233432024
Semiconductor Package and Method of Fabricating the Same
Samsung Electronics Co., Ltd.
0 cites
US117912822023
Semiconductor Package Including Part of Underfill on Portion of a Molding Material Surrounding Sides of Logic Chip and Memory Stack on Interposer and Method for Manufacturing the Same
Samsung Electronics Co., Ltd.
0 cites
US115944992023
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites