Patents/Inventors

Jaehyun Yeon

San Diego, CAUS12 patents

12 Patents

US125937052026
Hybrid Core Substrate with Embedded Components
QUALCOMM INCORPORATED
0 cites
US123008732025
Antenna Modules Employing a Package Substrate with a Vertically-integrated Patch Antenna(s), and Related Fabrication Methods
QUALCOMM INCORPORATED
0 cites
US122939802025
Package Comprising Discrete Antenna Device
QUALCOMM INCORPORATED
0 cites
US121257422024
Package Comprising a Substrate with High Density Interconnects
QUALCOMM INCORPORATED
0 cites
US121260712024
Multi-directional Antenna Modules Employing a Surface-mount Antenna(s) to Support Antenna Pattern Multi-directionality, and Related Fabrication Methods
QUALCOMM INCORPORATED
0 cites
US118698332024
Package Comprising a Substrate with a via Interconnect Coupled to a Trace Interconnect and Method of Fabricating the Same
QUALCOMM INCORPORATED
0 cites
US118239832023
Package with a Substrate Comprising Pad-on-pad Interconnects
QUALCOMM INCORPORATED
0 cites
US117644892023
Sub-module L-shaped Millimeter Wave Antenna-in-package
QUALCOMM INCORPORATED
0 cites
US117358042023
Multi-core Broadband PCB Antenna
QUALCOMM INCORPORATED
0 cites
US116370572023
Uniform via Pad Structure Having Covered Traces Between Partially Covered Pads
QUALCOMM INCORPORATED
0 cites
US115519392023
Substrate Comprising Interconnects Embedded in a Solder Resist Layer
QUALCOMM INCORPORATED
0 cites
US115454252023
Substrate Comprising Interconnects Embedded in a Solder Resist Layer
QUALCOMM INCORPORATED
0 cites