19 Patents
- US124532042025Semiconductor Package and Method of Manufacturing the Same
Samsung Electronics Co., Ltd.
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- US120150182024Semiconductor Package with Multiple Redistribution Substrates
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US119554992024Image Sensor Package Including Glass Substrate and a Plurality of Redistribution Layers Disposed Below the Glass Substrate and Spaced Apart from Each Other by a Predetermined Distance
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US119012762024Semiconductor Package and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US118879312024Semiconductor Package with Stepped Redistribution Structure Exposing Mold Layer
SAMSUNG ELECTRONICS CO., Ltd.
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- US118109152023Semiconductor Package with Redistribution Substrate Having Embedded Passive Device
SAMSUNG ELECTRONICS CO., Ltd.
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- US116370812023Semiconductor Package and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
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- US115691572023Semiconductor Package and Method of Manufacturing the Same
Samsung Electronics Co., Ltd.
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