Patents/Inventors

Jaeeun Lee

Hwaseong-siKR5 patents

6 Patents

US126108652026
Semiconductor Device and Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US124068882025
Semiconductor Substrate and Method of Dicing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119963672024
Semiconductor Device and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117912822023
Semiconductor Package Including Part of Underfill on Portion of a Molding Material Surrounding Sides of Logic Chip and Memory Stack on Interposer and Method for Manufacturing the Same
Samsung Electronics Co., Ltd.
0 cites
US117355222023
Semiconductor Device Including Plurality of Patterns
Samsung Electronics Co., Ltd.
0 cites
US116949632023
Semiconductor Device and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites