Patents/Inventors

Jaeean Lee

Suwon-siKR3 patents

4 Patents

US124890602025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US124697752025
Semiconductor Package Including Substrate Having a Dummy Pattern Between Pads
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122180992025
Interposer and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119904392024
Semiconductor Package Including Under Bump Metallization Pad
Samsung Electronics Co., Ltd.
0 cites