8 Patents
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- US124314032025Semiconductor Package Including Thermal Interface Material (TIM) Layers on Semiconductor Chips
SAMSUNG ELECTRONICS CO., Ltd.
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- US122438032025Thermal Interface Material, Method of Manufacturing the Same, and Semiconductor Packages Including the Same
UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY
0 cites - 0 cites
- US121990022025Semiconductor Package and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
- US119358122024Thermal Interface Material and Semiconductor Packages Including the Same
UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY
0 cites