Jae-woong Nah

7 Patents

• US124398342025

  Solder-shielded Chip Bonding

  INTERNATIONAL BUSINESS MACHINES CORPORATION

  0 cites
• US121070652024

  Uniform Chip Gaps via Injection-molded Solder Pillars

  INTERNATIONAL BUSINESS MACHINES CORPORATION

  0 cites
• US119904372024

  System and Method for Forming Solder Bumps

  INTERNATIONAL BUSINESS MACHINES CORPORATION

  0 cites
• US117667292023

  Molten Solder Injection Head with Vacuum Filter and Differential Gauge System

  International Business Machines Corporation

  0 cites
• US117496052023

  Hybrid Under-bump Metallization Component

  INTERNATIONAL BUSINESS MACHINES CORPORATION

  0 cites
• US116519732023

  Method and Apparatus of Processor Wafer Bonding for Wafer-scale Integrated Supercomputer

  International Business Machines Corporation

  0 cites
• US115414722023

  Ultrasonic-assisted Solder Transfer

  International Business Machines Corporation

  0 cites