9 Patents
- US124446102025Methods for Etching a Substrate Using a Hybrid Wet Atomic Layer Etching Process
Tokyo Electron Limited
0 cites - US122908352025Methods for Stabilization of Self-assembled Monolayers (sams) Using Sequentially Pulsed Initiated Chemical Vapor Deposition (spicvd)
Tokyo Electron Limited
0 cites - 0 cites
- US122437522025Systems for Etching a Substrate Using a Hybrid Wet Atomic Layer Etching Process
Tokyo Electron Limited
0 cites - US121319142024Selective Etching with Fluorine, Oxygen and Noble Gas Containing Plasmas
Université D'orleans
0 cites - US121129592024Processing Systems and Platforms for Roughness Reduction of Materials Using Illuminated Etch Solutions
Tokyo Electron Limited
0 cites - 0 cites
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- US116911752023Methods for Area-selective Deposition of Polymer Films Using Sequentially Pulsed Initiated Chemical Vapor Deposition (spicvd)
Tokyo Electron Limited
0 cites