6 Patents
- US126160522026Methods and Apparatus to Reduce Defects in Interconnects Between Semicondcutor Dies and Package Substrates
Intel Corporation
0 cites - US125435782026Electronic Packaging Architecture with Customized Variable Metal Thickness on Same Buildup Layer
Intel Corporation
0 cites - 0 cites
- US123344532025Soldered Metallic Reservoirs for Enhanced Transient and Steady-state Thermal Performance
Intel Corporation
0 cites - 0 cites
- US117768642023Corner Guard for Improved Electroplated First Level Interconnect Bump Height Range
Intel Corporation
0 cites