3 Patents
- US126222662026Die Level Cavity Heat Sink
BAE Systems Information And Electronic Systems Integration Inc.
0 cites - US119488552024Integrated Circuit (IC) Package with Cantilever Multi-chip Module (MCM) Heat Spreader
Rockwell Collins, Inc.
0 cites - US116055702023Reconstituted Wafer Including Integrated Circuit Die Mechanically Interlocked with Mold Material
Rockwell Collins, Inc.
0 cites