Patents/Inventors

Jackson Chung Peng Kong

Tanjung TokongMY41 patents

31 Patents

US126157142026
Vertical Interconnect Design for Improved Electrical Performance
Intel Corporation
0 cites
US126047472026
Opossum Redistribution Frame for Configurable Memory Devices
Intel Corporation
0 cites
US125990132026
Semiconductor Packages for Stacked Memory-on-package (SMOP) and Methods of Manufacturing the Same
INTEL CORPORATION
0 cites
US125124142025
Vertical Interconnect Design for Improved Electrical Performance
Intel Corporation
0 cites
US125001752025
Integrated Bridge Frame for Package Substrate
Intel Corporation
0 cites
US124127842025
Recessed Vertical Interconnects for Device Miniaturization
Intel Corporation
0 cites
US123288162025
Asymmetrical Laminated Circuit Boards for Improved Electrical Performance
Intel Corporation
0 cites
US122887402025
Semiconductor Package with Hybrid Mold Layers
Intel Corporation
0 cites
US122564872025
Hybrid Boards with Embedded Planes
Intel Corporation
0 cites
US122180642025
Molded Silicon Interconnects in Bridges for Integrated-circuit Packages
Intel Corporation
0 cites
US121912812025
Multi-chip Package with Recessed Memory
Intel Corporation
0 cites
US121837222024
Molded Interconnects in Bridges for Integrated-circuit Packages
Intel Corporation
0 cites
US121425702024
Composite Bridge Die-to-die Interconnects for Integrated-circuit Packages
Intel Corporation
0 cites
US121129972024
Micro Through-silicon via for Transistor Density Scaling
Intel Corporation
0 cites
US120806282024
Micro Through-silicon via for Transistor Density Scaling
Intel Corporation
0 cites
US120339532024
Electronic Device and Crosstalk Mitigating Substrate
Intel Corporation
0 cites
US120027472024
Integrated Bridge for Die-to-die Interconnects
Intel Corporation
0 cites
US119554312024
Interposer Structures and Methods for 2.5D and 3D Packaging
Intel Corporation
0 cites
US119424122024
Interposer with Flexible Portion
Intel Corporation
0 cites
US118879402024
Integrated Circuit Packages with Conductive Element Having Cavities Housing Electrically Connected Embedded Components
Intel Corporation
0 cites
US118879172024
Encapsulated Vertical Interconnects for High-speed Applications and Methods of Assembling Same
Intel Corporation
0 cites
US118374582023
Substrate with Gradiated Dielectric for Reducing Impedance Mismatch
Intel Corporation
0 cites
US117988942023
Devices and Methods for Signal Integrity Protection Technique
Intel Corporation
0 cites
US117586622023
Three Dimensional Foldable Substrate with Vertical Side Interface
Intel Corporation
0 cites
US116769102023
Embedded Reference Layers for Semiconductor Package Substrates
Intel Corporation
0 cites
US116520262023
Micro Through-silicon via for Transistor Density Scaling
Intel Corporation
0 cites
US116396232023
Micro-hinge for an Electronic Device
Intel Corporation
0 cites
US115748772023
Semiconductor Miniaturization Through Component Placement on Stepped Stiffener
INTEL CORPORATION
0 cites
US115629542023
Frame-array Interconnects for Integrated-circuit Packages
Intel Corporation
0 cites
US115629632023
Stacked Semiconductor Package and Method of Forming the Same
Intel Corporation
0 cites
US115575522023
3D Trench Reference Planes for Integrated-circuit Die Packages
Intel Corporation
0 cites