3 Patents
- US125754242026Wafer-level Package for Millimetre Wave and Thz Signals
Teknologian Tutkimuskeskus VTT Oy
0 cites - US117672182023Microelectromechanical Capacitive Pressure Sensor Having a Valve Portion Being Operable to Close First Output and Open Second Output to Equalize Pressure
Teknologian Tutkimuskeskus VTT Oy
0 cites - US116975862023Surface Micromechanical Element and Method for Manufacturing the Same
Teknologian Tutkimuskeskus VTT Oy
0 cites