Patents/Inventors

Ivan Nikitin

RegensburgDE28 patents

17 Patents

US126047522026
Semiconductor Die Package
Infineon Technologies Austria AG
0 cites
US125060512025
Semiconductor Package Comprising a Cavity with Exposed Contacts and a Semiconductor Module
Infineon Technologies Austria AG
0 cites
US124944182025
Power Module with Press-fit Contacts
Infineon Technologies AG
0 cites
US124380682025
Stacked Module Arrangement
Infineon Technologies Austria AG
0 cites
US123006432025
Solder Stop Feature for Electronic Devices
Infineon Technologies AG
0 cites
US122835632025
Semiconductor Module with Bond Wire Loop Exposed from a Molded Body and Method for Fabricating the Same
Infineon Technologies Austria AG
0 cites
US122118242025
Power Semiconductor Package Having First and Second Lead Frames
Infineon Technologies AG
0 cites
US120027242024
Power Module with Metal Substrate
Infineon Technologies Austria AG
0 cites
US119012732024
Power Module with Press-fit Contacts
Infineon Technologies AG
0 cites
US118625332024
Fluid-cooled Package Having Shielding Layer
Infineon Technologies AG
0 cites
US116887132023
Additive Manufacturing of a Frontside or Backside Interconnect of a Semiconductor Die
Infineon Technologies Austria AG
0 cites
US116826112023
Power Semiconductor Module
Infineon Technologies AG
0 cites
US116462582023
Electronic Devices Including Electrically Insulated Load Electrodes
Infineon Technologies AG
0 cites
US116263512023
Semiconductor Package with Barrier to Contain Thermal Interface Material
Infineon Technologies AG
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US116212042023
Molded Semiconductor Module Having a Mold Step for Increasing Creepage Distance
Infineon Technologies AG
0 cites
US115989042023
Power Semiconductor Module and Method for Producing a Power Semiconductor Module
Infineon Technologies AG
0 cites
US115748892023
Power Module Comprising Two Substrates and Method of Manufacturing the Same
Infineon Technologies AG
0 cites