7 Patents
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- US120402762024Device and Method of Very High Density Routing Used with Embedded Multi-die Interconnect Bridge
Intel Corporation
0 cites - US120149892024Device and Method of Very High Density Routing Used with Embedded Multi-die Interconnect Bridge
Intel Corporation
0 cites - 0 cites
- US117641582023Embedded Multi-die Interconnect Bridge Packages with Lithographically Formed Bumps and Methods of Assembling Same
Intel Corporation
0 cites - US115812712023Methods to Pattern TFC and Incorporation in the ODI Architecture and in Any Build Up Layer of Organic Substrate
Intel Corporation
0 cites - 0 cites