Patents/Inventors

Isao Ichikawa

TokyoJP4 patents

4 Patents

US124069602025
Method of Manufacturing Laminate by Sinter- Bonding Semiconductor Chip and Substrate
LINTEC CORPORATION
0 cites
US122887682025
Method of Manufacturing Laminate
LINTEC CORPORATION
0 cites
US119488652024
Film-shaped Firing Material and Film-shaped Firing Material with a Support Sheet
LINTEC CORPORATION
0 cites
US117077872023
Film-shaped Firing Material, Film-shaped Firing Material Provided with Support Sheet, Method for Manufacturing Film-shaped Firing Material, and Method for Manufacturing Film-shaped Firing Material Provided with Support Sheet
LINTEC Corporation
0 cites