6 Patents
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- US124127402025Semiconductor Device with a Porous Portion, Wafer Composite and Method of Manufacturing a Semiconductor Device
Infineon Technologies AG
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- US121071302024Semiconductor Device Having Semiconductor Device Elements in a Semiconductor Layer
Infineon Technologies AG
0 cites - US118813972024Semiconductor Device with a Porous Portion, Wafer Composite and Method of Manufacturing a Semiconductor Device
Infineon Technologies AG
0 cites - 0 cites