11 Patents
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- US118482852023Semiconductor Chip Including Buried Dielectric Pattern at Edge Region, Semiconductor Package Including the Same, and Method of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
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- US117841682023Semiconductor Chip, Semiconductor Device, and Semiconductor Package Including the Semiconductor Chip
SAMSUNG ELECTRONICS CO., Ltd.
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- US115748192023Semiconductor Device and Method for Manufacturing the Same
Samsung Electronics Co., Ltd.
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