Patents/Inventors

Insup Shin

SeoulKR2 patents

3 Patents

US122305752025
Carrier Structure Including Pockets for Accommodating Semiconductor Chip Stack Structure
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117569352023
Chip-stacked Semiconductor Package with Increased Package Reliability
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117216012023
Semiconductor Package and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites