Insang Yoon

2 Patents

• US118429912023

  Semiconductor Device and Method of Forming a 3D Interposer System-in-package Module

  STATS Chippac Pte. Ltd.

  0 cites
• US117157032023

  EMI Shielding for Flip Chip Package with Exposed Die Backside

  STATS Chippac Pte. Ltd.

  0 cites