Inkyu Park

3 Patents

• US117792322023

  Flexible Pressure Sensor Using Multi-material 3d-printed Microchannel Mold and Method for Manufacturing the Same

  KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

  0 cites
• US116475862023

  Substrate Layered Structure and Interposer Block

  LG ELECTRONICS Inc.

  0 cites
• US115669592023

  Soft Pressure Sensor Using Multi-material 3d-printed Microchannel Molds and Method for Making the Sensor

  KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

  0 cites