Inhyo Hwang

10 Patents

• US125987582026

  Semiconductor Device Including Dummy Pad

  Samsung Electronics Co., Ltd.

  0 cites
• US125436002026

  Memory Device

  Samsung Electronics Co., Ltd.

  0 cites
• US125124462025

  Semiconductor Package

  Samsung Electronics Co., Ltd.

  0 cites
• US124761792025

  Semiconductor Package Including Through-silicon via and Method of Forming the Same

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US124462372025

  Semiconductor Device

  Samsung Electronics Co., Ltd.

  0 cites
• US123880242025

  Semiconductor Package

  Samsung Electronics Co., Ltd.

  0 cites
• US122181002025

  Semiconductor Package

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US121598582024

  Semiconductor Package and Method of Fabricating the Same

  Samsung Electronics Co., Ltd.

  0 cites
• US120339482024

  Semiconductor Package

  Samsung Electronics Co., Ltd.

  0 cites
• US117841712023

  Semiconductor Device

  Samsung Electronics Co., Ltd.

  0 cites