In Seob Bae

5 Patents

• US123410862025

  Lead Frame

  HAESUNG DS CO., Ltd

  0 cites
• US123277282025

  Method for Manufacturing a Pre-mold Substrate

  HAESUNG DS CO., Ltd.

  0 cites
• US122495712025

  Pre-mold Substrate and Method of Manufacturing Pre-mold Substrate

  HAESUNG DS CO., Ltd.

  0 cites
• US118760122024

  Method of Manufacturing Semiconductor Package Substrate and Semiconductor Package Substrate Manufactured Using the Same

  HAESUNG DS CO., Ltd.

  0 cites
• US118548302023

  Method of Manufacturing Circuit Board

  HAESUNG DS CO., Ltd.

  0 cites