In Kim

5 Patents

• US125527812026

  Epoxy Compound, Composition Prepared Therefrom, Semiconductor Device Prepared Therefrom, Electronic Device Prepared Therefrom, Article Prepared Therefrom, and Method of Preparing Article

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US124043612025

  Amine-based Curing Agents, and Compositions, Semiconductor Packages, and Electronic Devices Including the Same

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US119266952024

  High-thermal Conductive Epoxy Compound and Composition, Material for Semiconductor Package, Molded Product, Electric and Electronic Device, and Semiconductor Package Including the Same

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US119014992024

  Battery Case and Battery

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US118277422023

  Epoxy Compound, Composition Prepared Therefrom, Semiconductor Device Prepared Therefrom, Electronic Device Prepared Therefrom, Article Prepared Therefrom, and Method of Preparing Article

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites