Patents/Inventors

Ilyas Mohammed

Santa Clara, CAUS33 patents

29 Patents

US126220032026
High Density Three-dimensional Integrated Capacitors
Adeia Semiconductor Solutions LLC
0 cites
US126160502026
Bonded Structure Including a First Microelectronic Device Direct Hybrid Bonded to a Second Microelectronic Device
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIE
0 cites
US125640842026
Bonded Structures Without Intervening Adhesive
Adeia Semiconductor Bonding Technologies Inc.
0 cites
US124944532025
Package-on-package Assembly with Wire Bonds to Encapsulation Surface
Adeia Semiconductor Solutions LLC
0 cites
US124885082025
Compressive Sensing Based Image Processing
Amazon Technologies, Inc.
0 cites
US124010102025
3D Processor Having Stacked Integrated Circuit Die
Adeia Semiconductor Inc.
0 cites
US123811192025
Seal for Microelectronic Assembly
Adeia Semiconductor Bonding Technologies Inc.
0 cites
US123533402025
Systems for High-speed Computing Using an Optical Interchange
Google LLC
0 cites
US123226672025
Seal for Microelectronic Assembly
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES Inc.
0 cites
US122939932025
3D Chip Sharing Data Bus
Adeia Semiconductor Inc.
0 cites
US122782152025
Integrated Voltage Regulator and Passive Components
Adeia Semiconductor Inc.
0 cites
US122709702025
Direct-bonded Lamination for Improved Image Clarity in Optical Devices
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES Inc.
0 cites
US122180592025
Stacked IC Structure with Orthogonal Interconnect Layers
Adeia Semiconductor Inc.
0 cites
USRE0502722025
Remote Optical Engine for Virtual Reality or Augmented Reality Headsets
Adeia Semiconductor Technologies LLC
0 cites
US121912672025
Nanowire Bonding Interconnect for Fine-pitch Microelectronics
Adeia Semiconductor Technologies, LLC
0 cites
US121425282024
3D Chip with Shared Clock Distribution Network
Adeia Semiconductor Inc.
0 cites
US121366052024
Layer Structures for Making Direct Metal-to-metal Bonds at Low Temperatures in Microelectronics and Method for Forming the Same
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES Inc.
0 cites
US121240352024
Stretchable Film Assembly with Conductive Traces
Adeia Semiconductor Technologies LLC
0 cites
US120573832024
Bonded Structures with Integrated Passive Component
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES Inc.
0 cites
US119141482024
Stacked Optical Waveguides
Adeia Semiconductor Inc.
0 cites
US118943452024
Integrated Voltage Regulator and Passive Components
Adeia Semiconductor Inc.
0 cites
US118814542024
Stacked IC Structure with Orthogonal Interconnect Layers
Adeia Semiconductor Inc.
0 cites
US118626042024
Systems and Methods for Releveled Bump Planes for Chiplets
Adeia Semiconductor Inc.
0 cites
US118308042023
Over and Under Interconnects
Invensas LLC
0 cites
US118308452023
Package-on-package Assembly with Wire Bonds to Encapsulation Surface
TESSERA LLC
0 cites
US118240422023
3D Chip Sharing Data Bus
Xcelsis Corporation
0 cites
US118174092023
Directly Bonded Structures Without Intervening Adhesive and Methods for Forming the Same
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES Inc.
0 cites
US116263632023
Bonded Structures with Integrated Passive Component
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES Inc.
0 cites
US115575162023
3D Chip with Shared Clock Distribution Network
Adeia Semiconductor Inc.
0 cites