Patents/Inventors

Il Kwon Shim

SingaporeSG11 patents

11 Patents

US124698192025
Semiconductor Device and Method of Forming Embedded Wafer Level Chip Scale Packages
STATS Chippac Pte. Ltd.
0 cites
US123026572025
Semiconductor Device and Method of Forming an Optical Semiconductor Package with a Shield Structure
UTAC Headquarters Pte. Ltd.
0 cites
US122118632025
Reliable Semiconductor Packages
UTAC Headquarters Pte Ltd.
0 cites
US121660502024
Reliable Semiconductor Packages
UTAC Headquarters Ptd Ltd.
0 cites
US121007192024
Reliable Semiconductor Packages
UTAC Headquarters Pte Ltd.
0 cites
US119617642024
Semiconductor Device and Method of Making a Wafer-level Chip-scale Package
STATS Chippac Pte. Ltd.
0 cites
US119013082024
Semiconductor Packages with Integrated Shielding
UTAC HEADQUARTERS PTE. Ltd.
0 cites
US118814942024
Semiconductor Package with Dams
UTAC HEADQUARTERS PTE. Ltd.
0 cites
US118429912023
Semiconductor Device and Method of Forming a 3D Interposer System-in-package Module
STATS Chippac Pte. Ltd.
0 cites
US117157032023
EMI Shielding for Flip Chip Package with Exposed Die Backside
STATS Chippac Pte. Ltd.
0 cites
US116705212023
Reliable Semiconductor Packages for Sensor Chips
UTAC Headquarters Pte. Ltd
0 cites