Patents/Inventors

I-han Huang

New TaipeiTW3 patents

3 Patents

US125754642026
Method of Forming Wafer-to-wafer Bonding Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US124827852025
Trim Free Wafer Bonding Methods and Devices
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US122370502025
Three-dimensional (3-D) Write Assist Scheme for Memory Cells
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites