I-chu Lin

2 Patents

• US123342752025

  Negative-pressure Packaging Method for Aluminum Electrolytic Capacitor

  CAPXON ELECTRONIC TECHNOLOGY CO., Ltd

  0 cites
• US119231482024

  Substrate-type Multi-layer Polymer Capacitor (MLPC) Having Electroplated Terminal Structure

  CAPXON ELECTRONIC TECHNOLOGY CO., Ltd.

  0 cites