4 Patents
- US121293382024Thermosetting Resin Composition for Semiconductor Package, Prepreg and Metal Clad Laminate Using the Same
LG Chem, Ltd.
0 cites - 0 cites
- US120374912024Resin Composition, Prepreg Including the Same, Laminated Plate Including the Same, Resin-coated Metal Foil Including the Same
LG CHEM, Ltd.
0 cites - US115978372023Thermosetting Resin Composition for Semiconductor Package, Prepreg and Metal Clad Laminate Using the Same
LG CHEM, Ltd.
0 cites