Patents/Inventors

Hyunsu Sim

Cheonan-siKR2 patents

3 Patents

US120626262024
Semiconductor Substrate and Method of Sawing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US118548922023
Substrate Dicing Method, Method of Fabricating Semiconductor Device, and Semiconductor Chip Fabricated by Them
Samsung Electronics Co., Ltd.
0 cites
US116769142023
Semiconductor Substrate and Method of Sawing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites