Patents/Inventors

Hyunsu Hwang

Siheung-siKR14 patents

14 Patents

US125937022026
Semiconductor Package and Method of Fabricating the Same
Samsung Electronics Co., Ltd.
0 cites
US124566272025
Dry Etching Apparatus and Wafer Etching System Using the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US124514742025
Semiconductor Package and Method of Manufacturing the Same
Samsung Electronics Co., Ltd.
0 cites
US123811512025
Semiconductor Device and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US123477602025
Interconnection Structure and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122242562025
Wafer Structure and Semiconductor Device
Samsung Electronics Co., Ltd.
0 cites
US121193062024
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US120274822024
Semiconductor Chip Having a Through Electrode and Semiconductor Package Including the Semiconductor Chip
Samsung Electronics Co., Ltd.
0 cites
US120092882024
Interconnection Structure and Semiconductor Package Including the Same
Samsung Electronics Co., Ltd.
0 cites
US119233092024
Semiconductor Package Including Fine Redistribution Patterns
Samsung Electronics Co., Ltd.
0 cites
US118548932023
Method of Manufacturing Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US117988722023
Interconnection Structure and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116826302023
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US116643122023
Semiconductor Device and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites