Patents/Inventors

Hyunsoo Chung

Suwon-siKR18 patents

14 Patents

US125987582026
Semiconductor Device Including Dummy Pad
Samsung Electronics Co., Ltd.
0 cites
US125820092026
Semiconductor Package Including Pads
Samsung Electronics Co., Ltd.
0 cites
US125124462025
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US124761792025
Semiconductor Package Including Through-silicon via and Method of Forming the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US124462372025
Semiconductor Device
Samsung Electronics Co., Ltd.
0 cites
US123880242025
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US121660132024
Semiconductor Package, and a Package on Package Type Semiconductor Package Having the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US121598582024
Semiconductor Package and Method of Fabricating the Same
Samsung Electronics Co., Ltd.
0 cites
US121548892024
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120339482024
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US120093282024
Semiconductor Package and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119232922024
Semiconductor Device and Method of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117054182023
Semiconductor Package with Conductive Bump on Conductive Post Including an Intermetallic Compound Layer
Samsung Electronics Co., Ltd.
0 cites
US115748192023
Semiconductor Device and Method for Manufacturing the Same
Samsung Electronics Co., Ltd.
0 cites