Patents/Inventors

Hyungsun Jang

Hwaseong-siKR6 patents

6 Patents

US123227202025
Semiconductor Package Including Post
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122372852025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122059132025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119675782024
Semiconductor Package Including Post
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117697432023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115575602023
Semiconductor Package for Improving Reliability
SAMSUNG ELECTRONICS CO., Ltd.
0 cites