12 Patents
- US126160142026Semiconductor Device Including a Through Electrode Contacting a Backside Conductive Pattern and a Frontside Conductive Pattern and a Semiconductor Package Including the Same
Samsung Electronics Co., Ltd.
0 cites - US125937142026Semiconductor Device Including Bonding Enhancement Layer and Method of Forming the Same
Samsung Electronics Co., Ltd.
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- US123006712025Semiconductor Packages and Methods of Manufacturing the Semiconductor Packages
Samsung Electronics Co., Ltd.
0 cites - 0 cites
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- US118109002023Semiconductor Packages Stacked by Wafer Bonding Process and Methods of Manufacturing the Semiconductor Packages
Samsung Electronics Co., Ltd.
0 cites - 0 cites
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- US116949802023Semiconductor Stack and Method for Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites