Patents/Inventors

Hyunggil Baek

Suwon-siKR14 patents

11 Patents

US125572092026
Printed Circuit Board Having Cutting Position Identification Mark and Alignment Mark and Semiconductor Package Having the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US125577122026
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US125309202026
Fingerprint Sensor Package and Device Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US124944392025
Semiconductor Packages Having Fixing Members
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US124697492025
Method of Manufacturing Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US124514372025
Semiconductor Packages Having Fixing Members
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US123082532025
Molded Product for Semiconductor Strip and Method of Manufacturing Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US122085412025
Dicing Blade Including Diamond Particles
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122059252025
Semiconductor Package Having Package Substrate
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120876502024
Interposer and Semiconductor Package Including the Same
Samsung Electronics Co., Ltd.
0 cites
US116886562023
Interposer and Semiconductor Package Including the Same
Samsung Electronics Co., Ltd.
0 cites