Patents/Inventors

Hyung Sun Jang

Hwasung-siKR2 patents

3 Patents

US118625892024
Wafer-level Package Including Under Bump Metal Layer
Samsung Electronics Co., Ltd.
0 cites
US118108782023
Wafer-level Package Including Under Bump Metal Layer
Samsung Electronics Co., Ltd.
0 cites
US117891412023
Omnidirectional Sensor Fusion System and Method and Vehicle Including the Same
KIA MOTORS CORPORATION
0 cites